发明名称 |
DEVICE AND METHOD FOR MAKING DEVICES COMPRISING AT LEAST A CHIP FIXED ON A SUPPORT |
摘要 |
A method for mounting, on a support, at least a microcircuit in the form of a chip produced on a very thin semiconductor substrate. An interconnection point is provided at the chip in the form of a bump contact in weldable material. The bump contact has a welding surface in the same plane as at least one of the chip faces. An interconnection pad is provided on the support that is designed to be welded with a corresponding bump contact of the chip. The welding face of each bump contact of the chip is placed opposite each corresponding interconnection pad of the support. Each bump contact of the chip is welded with each corresponding interconnection pad of the support. The method can be applied to a device such as a chip card. |
申请公布号 |
EP1192592(A1) |
申请公布日期 |
2002.04.03 |
申请号 |
EP20000938859 |
申请日期 |
2000.05.30 |
申请人 |
GEMPLUS |
发明人 |
CALVAS, BERNARD;FIDALGO, JEAN-CHRISTOPHE;PATRICE, PHILIPPE |
分类号 |
G06K19/077;H01L21/60;H01L23/498;H01L23/538 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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