| 摘要 |
<p>The invention relates to an electrical-mechanical connection between electronic circuit systems (10) and substrates (20). According to the invention, the electronic circuit systems (10) and substrates (20) are connected to one another in a mechanically fixed manner and the electrical connection elements (11, 21) thereof are connected in an electrically conductive manner via microcapsules (23-1, 23-2) comprised of granules (23-1) which are at least, in part, electrically conductive and which are coated with a dielectric (23-2). In addition an electrically conductive soldered connection (25 to 28) exists between microcapsules (23-1, 23-2) with a forced open dielectric (23-2) and the electrical connection elements (11, 21).</p> |
