Method of molding circuitry using mold structure

摘要

A mold structure for molding a circuitry comprises a cavity to which a plurality of bus bars are juxtaposedly inserted provided with gap portions to which a resin material to be injected therethrough; and a plurality of holder pins provided on the respective gap portions and arranged alternatively in the juxtaposition direction of the plural bus bars to hold the respective bus bar to be inserted therebetween.