| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting structure in which connection between a semiconductor device and a mounting substrate is further stabilized. SOLUTION: In a mounting structure of a semiconductor device 10 to a mounting substrate 12, in which a metal bump 16 that is electrically connected to a pad 18 of the mounting substrate 12, is fitted to an electrode 14, the metal bump 16 is formed out of a metal material whose melting point is higher than that of eutectic solders 20 and 22, the metal bump 16 and the pad 18 are soldered using the eutectic solder 22, and the metal bump 16 and the electrode 14 are soldered using the eutectic solder 20 whose fatigue property is higher than that of the eutectic solder 22 used between the metal bump 16 and the pad 18.</p> |
