| 摘要 |
The present invention refers to a hermetic sealing arrangement (10, 10', 510) and a method for sealing electric components on a carrier (30, 530), said sealing arrangement comprising a cup of at least one layer (17, 517) of metallic layer, provided to be attached to a metallic pattern (31, 531) encircling a selected area to be sealed. The sealing arrangement is formed with an attachment section (11, 11', 511) and a temporary attachment layer (15, 515) is arranged covering at least one side of said attachment section facing said carrier, said temporary attachment layer having an exposing part (13, 513) exhibiting at least part of said attachment section to said metallic pattern on said carrier. For sealing, said exposed part is arranged to allow galvanic attachment of said metallic layer to said metallic pattern (31, 531). |
