摘要 |
An electrical component assembly includes a first printed circuit board (PCB) having a plurality of first-PCB conductive paths communicating with the surface of the first PCB, the assembly also includes at least one additional PCB having a plurality of additional-PCB conductive paths communicating with the surface of the PCB, with the conductive paths located such that when the additional PCBs and the first PCB are positioned one on top of the other, the conductive paths of the PCBs are substantially aligned, the conductive paths being formed from solder-filled vias passing through the PCBs and electrically-conductive junction pads positioned on the surface of the PCBs. The assembly also includes a plurality of electrical circuit components, wherein each component is electrically connected to a conductive path of one of the PCBs at one end and to a conductive path of another of the PCBs at the other end, the assembly also includes a plurality of traces that connect conductive paths. In some assemblies the traces configure some of the electrical components in a series arrangement whereas in other assemblies the traces configure some of the electrical components in a parallel arrangement.
|