发明名称 |
Process for spin-on coating with an organic material having a low dielectric constant |
摘要 |
A process for spin-on coating with an organic material having a low dielectric constant, which is suitable for a substrate. A dielectric base layer capable of protecting metal is formed on the substrate, an adhesive promoter layer is formed on the dielectric base layer, and the adhesive promoter layer is baked. A solvent is then used to clean the substrate and simultaneously to dissolve a part of the adhesive promoter layer in order to flatten the adhesive promoter layer. Afterwards, a layer of an organic material with a low dielectric constant is spin-on coated on the adhesive promoter layer, and the layer of an organic material with a low dielectric constant is baked and cured.
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申请公布号 |
US6365228(B1) |
申请公布日期 |
2002.04.02 |
申请号 |
US20000685430 |
申请日期 |
2000.10.10 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
TSAI CHENG-YUAN;YANG MING-SHENG;LIN CHIN-HSIANG |
分类号 |
H01L21/312;H01L21/316;(IPC1-7):B05D3/12 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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