MOLDING COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a molding composition having excellent heat conductivity. SOLUTION: This molding composition comprises (A) a thermosetting resin and (B) an inorganic filler containing >=20 wt.% based on the total of the inorganic filler of aluminum hydroxide. The amount of the component B is set >=60 wt.% based on the total of the molding composition. The cured body of the molding composition is provided with physical properties (X) of >=1 W/mK heat conductivity (λ) and <=20 ppm coefficient of linear expansion (α).