| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is a liquid sealant excellent in temperature cycle, permeation, fillet, quick curability, moisture resistant reliability or the like. SOLUTION: In a liquid epoxy resin composition at room temperature, which uses an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler as essential components. The epoxy resin composition contains at least a bisphenol A epoxy resin or the like as an epoxy resin, and the same contains an acid anhydride shown by the formula (A) as a curing agent, and amine adduct particles or the like as a curing accelerator. In addition, the same contains 10-60 vol.% by true specific gravity conversion, spherical amorphous silica or the like whose maximum diameter of the particle is 0.5-20μm, to the epoxy resin composition whole quantity as an inorganic filler. (In the formula, R1-R3 is respectively a 1-6C hydrocarbon group or hydrogen atom, and the total of the number of carbon atoms in the R1-R3 is 6, the total of the number of hydrogen atoms in the R1-R3 is 13).
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