发明名称 Cylindrical capacitor structure and method of manufacture
摘要 A cylindrical capacitor structure and a corresponding method of manufacture. To form the cylindrical capacitor, a conductive section, an etching stop layer, a first insulation layer, a bit line structure and a second insulation layer are sequentially formed over a substrate. A portion of the second insulation layer and the first insulation layer is removed until the etching stop layer is exposed. Ultimately, a plurality of gap-connected cylindrical openings and node contact openings between spacers are sequentially formed. Conductive spacers are formed on the sidewalls of the cylindrical openings and the node contact openings. In the meantime, material similar to the conductive spacers fills the small gaps, thereby forming an upper electrode for the capacitor. A dielectric layer is formed over the capacitor electrode. The exposed etching stop layer at the bottom of the contact opening is removed to expose the conductive section above the substrate. Finally, conductive material is deposited into the node contact openings and the cylindrical openings to become the lower electrodes and the node contacts respectively.
申请公布号 US6365955(B1) 申请公布日期 2002.04.02
申请号 US20010949519 申请日期 2001.09.10
申请人 UNITED MICROELECTRONICS CORP. 发明人 LEE TZUNG-HAN;HOU ALEX;LIN KUN-CHI
分类号 H01L21/02;H01L21/8242;H01L27/108;(IPC1-7):H01L29/00;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L21/02
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