发明名称 THERMOSETTING CONDUCTIVE ADHESIVE SHEET, AND ADHESION STRUCTURE AND ADHESION METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To prepare a thermosetting conductive adhesive sheet which enables a mechanically, thermally, and electrically stable electrical connection with a low resistance to be formed by a simple and convenient operation. SOLUTION: This adhesive sheet has a sheet-like conductive layer having front and back surfaces and an adhesive layer formed on the front surface of the conductive layer. The conductive layer has projections projected to the front surface side, and the adhesive layer is formed from a thermosetting adhesive. When the adhesive layer is press bonded under heating to an adherend, the projections of the conductive layer penetrate through the adhesive layer and come into contact with the adherend.
申请公布号 JP2002097424(A) 申请公布日期 2002.04.02
申请号 JP20000273119 申请日期 2000.09.08
申请人 THREE M INNOVATIVE PROPERTIES CO 发明人 KAWATE KOICHIRO;HIRASAWA YUJI
分类号 B32B3/30;C09J5/06;C09J7/02;C09J163/00;C09J171/10;H01B5/14;H01B17/62;H01R4/04;H05K3/32;H05K3/40;(IPC1-7):C09J7/02 主分类号 B32B3/30
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