| 摘要 |
A novel lead-free Sn-Bi based alloy having an improved wettability in comparison to conventional Sn-Bi based alloys, a melting point lower than 221° C., the eutectic point of an Sn-Ag alloy, and proper bonding and heat-resistant properties is provided. This alloy is an Sn-Bi based alloy containing tin as a major component, and 21 wt.% or less bismuth, 4 wt.% or less silver, 2 wt.% or less copper (inclusive of zero), and 0.2 wt.% or less nickel.
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