| 摘要 |
PROBLEM TO BE SOLVED: To provide stability in behavior of a retainer ring during polishing, and uniformity and stability in polishing by keeping constant the distance between the retainer ring and a peripheral edge part (edge part) of an object to be polished, and to surely hold the polishing object without deforming at the time of transporting the polishing object. SOLUTION: This substrate holding device comprises: a top ring body 2 for holding a semiconductor wafer W; the retainer ring 3 arranged fixed to or integral with the top ring body 2 and holding the outer peripheral edge of the semiconductor wafer W; a fluid chamber 8 covered with an elastic film 4 having an opening 4a and provided to an inside of the top ring body 2 to which fluid is supplied; and sucking parts 14 each of which is arranged to each opening 4a of the elastic film 4 and has a communicating hole 14h. The semiconductor wafer W is pressed against a polished surface by supplying a pressure fluid inside a fluid chamber 8, and communicating hole 14h of the adsorption part 14 is made to communicate with a vacuum source 25 thereby sucking the semiconductor wafer W by the sucking part 14. |
