| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin high in solder thermostability, resistive to solder reflow at a high temperature, and having a good moldability. SOLUTION: The epoxy resin composition is composed of an epoxy resin (A), a hardening agent (B), a filler (C), and a silane coupling agent (D). This epoxy resin (A) contains a bisphenol F type epoxy compound, the hardening agent (B) contains the hardening agent (b) given by chemical formula (I), the filler (C) contains a spherical silica, and the ratio of the filler (C) is 88-96 wt.% of the total of the resin component.
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