发明名称 |
Heat-dissipating assembly for removing heat from a flip chip semiconductor device |
摘要 |
A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the chip (12) when mounted to a flexible substrate (16). Heat is conducted from the chip (12) with a heat-conductive member (26) brought into thermal contact with the surface of the chip (12) opposite solder bump connections (18) that attach the chip (12) to the substrate (16). A biasing member (30) biases the substrate (16) against the chip (12) so as to maintain thermal contact between the chip (12) and the heat-conductive member (26). A thermally-conductive lubricant (32) is preferably provided between the surface of the chip (12) and the heat-conductive member (26) in order to promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansions and movement between the chip (12), substrate (26) and heat-conductive member (26). The substrate (16) and chip (12) are preferably enclosed within a housing (14) that incorporates the heat-conductive member (26). The housing (14) may further include fins (28) in order to promote heat dissipation from the housing (14) to the environment.
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申请公布号 |
US6365964(B1) |
申请公布日期 |
2002.04.02 |
申请号 |
US20000692240 |
申请日期 |
2000.10.20 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
KOORS MARK ANTHONY;DEVOS GLEN W |
分类号 |
H01L23/367;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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