Fused spherical silica, method for producing same and liquid sealing resin composition

摘要

The present invention relates to a fused spherical silica having a maximum particle size of 45 mum, an average particle size of 2 to 10 mum, and a ratio of a specific surface area Sw1 of the particles to a theoretical specific surface area Sw2 of the particles, Sw1/Sw2, of 1.0 to 2.5, the surface of the particles being smooth. The present invention can provide a liquid sealing resin composition having sufficiently low viscosity for sealing a slight gap between a substrate and an IC chip and also having high reliability, and a fused spherical silica filler to be filled therein.