发明名称 |
Method for forming a thin film resistor |
摘要 |
The invention provides a method for forming a thin film resistor, which comprises the following steps: providing an insulator substrate; forming a patterned conductive layer over the insulator substrate by a non-photolithographic method; forming a thin film resistive layer on the patterned conductive layer and the insulator substrate; patterning the thin film resistive layer by photolithography. Using the method for forming a thin film resistor in accordance with the invention, the fabrication costs of the thin film resistor can be lowered.
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申请公布号 |
US6365483(B1) |
申请公布日期 |
2002.04.02 |
申请号 |
US20000668773 |
申请日期 |
2000.09.22 |
申请人 |
VIKING TECHNOLOGY CORPORATION |
发明人 |
LIN HORNG-BIN;KUO HSIEN-CHANG |
分类号 |
H01C17/06;H01C7/00;H01C17/242;H01L21/02;(IPC1-7):H01L21/20 |
主分类号 |
H01C17/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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