发明名称 Method for forming a thin film resistor
摘要 The invention provides a method for forming a thin film resistor, which comprises the following steps: providing an insulator substrate; forming a patterned conductive layer over the insulator substrate by a non-photolithographic method; forming a thin film resistive layer on the patterned conductive layer and the insulator substrate; patterning the thin film resistive layer by photolithography. Using the method for forming a thin film resistor in accordance with the invention, the fabrication costs of the thin film resistor can be lowered.
申请公布号 US6365483(B1) 申请公布日期 2002.04.02
申请号 US20000668773 申请日期 2000.09.22
申请人 VIKING TECHNOLOGY CORPORATION 发明人 LIN HORNG-BIN;KUO HSIEN-CHANG
分类号 H01C17/06;H01C7/00;H01C17/242;H01L21/02;(IPC1-7):H01L21/20 主分类号 H01C17/06
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