发明名称 300 mm CVD chamber design for metal-organic thin film deposition
摘要 The present invention relates to plasma-enhanced chemical vapor deposition (PECVD) and related chamber hardware. Embodiments of the present invention include a PECVD system for depositing a film of titanium nitride from a TDMAT precursor. The present invention broadly provides a chamber, a gas delivery assembly, a pedestal which supports a substrate, and a plasma system to process substrates. In general, the invention includes a chamber body and a gas delivery assembly disposed thereon to define a chamber cavity. A pedestal movably disposed within the chamber cavity is adapted to support a substrate during processing. The gas delivery assembly is supported by the chamber body and includes a temperature control plate and a showerhead mounted thereto. Preferably, the interface between the showerhead and temperature control plate is parallel to a radial direction of the gas delivery assembly to accommodate lateral thermal expansion without separation of the showerhead and the temperature control plate. A blocker plate, or baffle plate, may be disposed between the showerhead and temperature control plate to facilitate dispersion of gases delivered thereto.
申请公布号 US6364949(B1) 申请公布日期 2002.04.02
申请号 US19990421779 申请日期 1999.10.19
申请人 APPLIED MATERIALS, INC. 发明人 OR DAVID T.;KOAI KEITH K.;CHEN FUFA;LEI LAWRENCE C.
分类号 C23C16/44;C23C16/455;C23C16/509;(IPC1-7):B05C11/06 主分类号 C23C16/44
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