Wafer holder for semiconductor manufacturing apparatus

摘要

A wafer holder includes a heater interposed between at least one pair of ceramic base members. The wafer holder can be regarded as including a holding surface side structure on a side of the heater facing toward the wafer, and a backside structure on the opposite side of the heater. The backside structure has a heat insulating character. The ceramic base member in the backside structure is formed of ceramic having a lower heat conductivity than that of the ceramic base member in the holding surface side structure. Further, the ceramic base member in the backside structure has a heat conductivity of 100 W/mK or less and a joint layer has a heat conductivity of 10 W/mK or less. In this way, the wafer holder prevents heat from spreading toward the backside of the wafer holder.