SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor package is provided to prevent outside moisture or particles from penetrating through an interface between a plating layer and a passivation layer, by making a nickel plating layer chemically contact the passivation layer to increase adhesion. CONSTITUTION: A bonding pad part(22) is formed on a surface of a semiconductor chip(21). A metal pad of a thin film and a multilayered plating layer are sequentially stacked on the bonding pad part. The passivation layer(23) is made of an insulation material chemically coupled to the plating layer by using a metal nucleus as a medium, formed on a part of the metal pad and the semiconductor chip. A solder ball(27) is formed on the multilayered plating layer.