发明名称 SEMICONDUCTOR DEVICE WITH CIRCUIT DECREASING NUMBER OF PADS FOR TESTING WAFER
摘要 PURPOSE: A semiconductor device with a circuit for decreasing the number of pads for testing a wafer is provided to prevent a chip size of an inner circuit from being increased, by checking a direct current(DC) voltage level of the inner circuit in a wafer test and by decreasing the number of pads used for applying a DC voltage to the inner circuit. CONSTITUTION: The pad(100) checks the DC voltage level of the inner circuit in a test or applies the DC voltage to the inner circuit. A switch control unit(120) generates a plurality of switch control signals. A switching unit(110) includes a plurality of switches. The switches transmit the DC voltage applied through the pad to the inner circuit or transmit the DC voltage corresponding to the control signal among the plurality of DC voltages generated from the inner circuit to the pad, in response to a corresponding control signal among the plurality of control signals of the switch control unit.
申请公布号 KR20020024420(A) 申请公布日期 2002.03.30
申请号 KR20000056159 申请日期 2000.09.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LIM, SEONG MIN
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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