| 摘要 |
PROBLEM TO BE SOLVED: To avoid contact failures caused by chips, without impairing effective utilization of water or increasing cost. SOLUTION: Marks or patterns, required for manufacturing wafer, are arranged along both sides of dicing region on a wafer. Internal terminals 3 of the chip body are arranged outside of an alignment line of these marks or patterns. Dividing the dicing region into a plurality of chips, by cutting the dicing region in a central part between marks or patterns arranged in two lines in once time with a blade will not cause chips, including metal layer of marks or patterns. This can avoid contact failure caused by chips instead of increasing cost. Since the marks or patterns are arranged in the region with anticipation of cracks caused by the cutting, effective utilization of wafer is not diminished. |
