| 摘要 |
PROBLEM TO BE SOLVED: To reduce the labor of the step for surface treating a semiconductor pellet in the manufacturing process of a semiconductor device. SOLUTION: A semiconductor wafer is mounted on a stretching sheet 1 having a surface treating liquid 2 in a step for mounting a semiconductor wafer, a plurality of scratches are made on the surface of the semiconductor wafer mounted on the stretching sheet 1 in a scribing step, the semiconductor wafer is separated into a plurality of semiconductor pellets 3aa-3af by stretching the stretching sheet 1 in a sheet stretching step, the stretched sheet 1 is left, as it is, for a specified time so that the surface treating liquid 2 in the stretched sheet 1 is diffused to the surface of the semiconductor pellets 3aa-3af through capillarity of a gap 4 at the separating part of the semiconductor wafer 3 in a surface treating liquid diffusing step. |
