DISPENSER FOR SOLDER PASTE

摘要

PROBLEM TO BE SOLVED: To provide a dispenser for solder pate by which a solder pate having a uniform composition can be applied to a substrate in a uniform thickness and no clogging of solder paste occurs. SOLUTION: This dispenser for solder paste is provided at least with a hopper to supply material, a screw provided with a screw shaft which mixes the material uniformly and extrudes it, and a nozzle to discharge the uniformly mixed material.