发明名称 APPARATUS AND METHOD FOR RECOVERING ANALYZING LIQUID USED FOR MEASURING QUANTITY OF IMPURITY ON WAFER SURFACE
摘要 PROBLEM TO BE SOLVED: To improve efficiency and reliability of analyzing liquid recovery by means of an analyzing liquid recovering apparatus and the productivity of the device for wafer treatment, and at the same time, to reduce the occurrence of particles and the occupying space of the apparatus. SOLUTION: The analyzing liquid recovering apparatus is provided with an arm 7, which is provided rotatably and vertically movably above a work stage 1 and has a nozzle 8, which recovers an analyzing liquid by suction at its front end, an arm-driving device 6 which rotates, elevates, and lowers the arm 7, and a sucking and discharging device 9 which causes the nozzle 7 to suck and discharge the analyzing liquid. The recovering device is also provided with a CCD camera 4 which images the surface section w of a semiconductor wafer W, placed on the stage 1 and outputs picked-up image data and a controller 10 which is connected to the camera 4 and outputs a drive signal to the arm-driving device 6 and sucking and discharging device 9, by calculating the barycentric coordinate position of the analyzing liquid on the surface section w of the wafer W from the image data.
申请公布号 JP2002093872(A) 申请公布日期 2002.03.29
申请号 JP20000275055 申请日期 2000.09.11
申请人 TOSHIBA CERAMICS CO LTD 发明人 EBINA MAKOTO;IWAI SEIJI;KONDO SHINSUKE
分类号 G01N1/00;G01N1/28;G01N1/32;G01N33/00;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01N1/00
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