摘要 |
PROBLEM TO BE SOLVED: To improve efficiency and reliability of analyzing liquid recovery by means of an analyzing liquid recovering apparatus and the productivity of the device for wafer treatment, and at the same time, to reduce the occurrence of particles and the occupying space of the apparatus. SOLUTION: The analyzing liquid recovering apparatus is provided with an arm 7, which is provided rotatably and vertically movably above a work stage 1 and has a nozzle 8, which recovers an analyzing liquid by suction at its front end, an arm-driving device 6 which rotates, elevates, and lowers the arm 7, and a sucking and discharging device 9 which causes the nozzle 7 to suck and discharge the analyzing liquid. The recovering device is also provided with a CCD camera 4 which images the surface section w of a semiconductor wafer W, placed on the stage 1 and outputs picked-up image data and a controller 10 which is connected to the camera 4 and outputs a drive signal to the arm-driving device 6 and sucking and discharging device 9, by calculating the barycentric coordinate position of the analyzing liquid on the surface section w of the wafer W from the image data.
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