| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which is improved in properties of transferring a certain object from a transfer original plate to a transfer board as an object of transfer. SOLUTION: This wiring board manufacturing method includes a process in which a transfer original plate is equipped with a transfer body 1 on which a conductive layer 2 and an electrodeposition film 4 are formed, the surface of the electrodeposition film 4 is roughened by a physical treatment or a chemical treatment, then the transfer original plate is fixed to a board 5 as an object of transfer by application of pressure, then the board 5 is separated off, and the conductive layer 2 and the electrodeposition film 4 are transferred once, where the electrodeposition film 4 is formed of organic solvent-soluble polyimide (A) and hydrophilic polymer (B). At least a conductive layer is formed on a board through the intermediary of an insulating resin layer 3 for the formation of a wiring board, the insulating layer and the conductive layer are formed by transfer, and the insulating resin layer is transferred after the contacting surface of the electrodeposition film 4 which is formed of organic solvent-soluble polyimide (A) and hydrophilic polymer (B) and brought into contact with the board is roughened by a physical treatment or a chemical treatment.
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