| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming an organic resist film high enough in strength to stand an etchant spray in an etching process. SOLUTION: An organic film 9 is selectively formed on the surface of a copper plating by the use of an alkyl benzimidazole solution, and the exposed part of the copper plating is etched, using the organic film 9 as an etching resist in a process of manufacturing a copper through-hole printed wiring board. All the surface of the copper plating 4 including the inner wall of a through-hole is subjected to a blacking treatment 5 before an organic film is formed.
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