| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit material using conductive paste that shows a superior heat resistance, moisture resistance, thermal shock resistance, and flex resistance and also a superior adhesive property against organic films, metallic substrates, glass substrates, etc. SOLUTION: In the conductive paste composed mainly of conductive powder (A), a bonding agent containing a polyester resin (B) having a number average molecular weight of >=3,000, and a solvent (C), the polyester resin (B) holds >=60% of its original reduced viscosity after the resin (B) is left as it is for 500 hours under the condition of 85 deg.C in temperature and 85% in relative humidity.
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