SEMICONDUCTOR PACKAGE FOR MEMORY CARD AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor package for a memory card is provided to reduce a possibility that the semiconductor package is deformed by heat or pressure, by using a metal plate in a circuit board instead of a stacked plate made of plastics. CONSTITUTION: The circuit board is composed of a plurality of metal plates(31) constituting a circuit terminal, separated form each other. The first adhesive tape(33) having at least a layer is attached to fix the metal plate of the circuit board. A memory chip(25) is attached to the upper portion of the circuit board. The metal plate of the circuit board is wire-bonded to the memory chip by a wire(27). The second adhesive tape(35) having at least a layer is attached to the upper surface of the first adhesive tape so that the second adhesive tape functions as a dam ring. Molding compound(28) is molded in a portion to which the memory chip and the wire are bonded.