| 摘要 |
PURPOSE: A multi-layer PCB and method for manufacturing the same is provided to obtain an accurate and high quality PCB by preventing occurrence of mis-match, while allowing heat to be transferred uniformly all over the sheet plate. CONSTITUTION: Each sheet plate(30) constituting a PCB has two or more guide holes(34) formed at the inner layer of the sheet plate. A copper sheet(32) has a diameter larger than the diameter of the guide hole such that the heat supplied from an external source is transferred to the center of the board. A method comprises a first step of preparing a copper clad laminate to be used as an internal layer of a PCB; a second step of forming an inner circuit pattern at the copper clad laminate, and patterning the thermal conductive copper sheet pattern at the upper and lower portion of periphery of the copper clad laminate; a third step of obtaining the inner circuit pattern and thermal conductive copper sheet pattern through an etching; a fourth step of forming a reference hole passing through the center of the thermal conductive copper sheet pattern; a fifth step of aligning the sheet plates having the thermal conductive copper sheet pattern, and inserting a heat supply tool into the reference hole; and a sixth step of allowing the heat supply tool to supply heat to the thermal conductive copper sheet pattern, and pressing each plate sheet.
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