发明名称 COOLING DEVICE FOR POWER MODULE
摘要 PROBLEM TO BE SOLVED: To perform miniaturization without damaging the cooling performance of a power module in an SHEV system. SOLUTION: The reflux diode FWD of an inverter 15 on a power generator side and the switching element IGBT of a motor side inverter 16 are arrayed on one straight line on a cooling plate 21 for each phase, and coolant piping 22 is turned to a meandering structure so as to pass through only a part right below the straight array for each phase. Thus, the passage length of a coolant flow passage is shortened, the number of times of bending the flow passage is reduced, power for coolant distribution by a cooling pump is reduced, the size of a cooling system is reduced, and costs are lowered.
申请公布号 JP2002093974(A) 申请公布日期 2002.03.29
申请号 JP20000278539 申请日期 2000.09.13
申请人 NISSAN MOTOR CO LTD 发明人 KANEKO HIROYUKI
分类号 H05K7/20;B60K6/20;B60K6/22;B60K6/26;B60K6/46;B60L3/00;H01L23/473;H01L25/07;H01L25/18;H02M7/04;H02M7/48 主分类号 H05K7/20
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