| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing system, a polishing pad and a polishing method exhibiting a high level difference relaxing performance. SOLUTION: While pushing a semiconductor substrate 3 against a polishing pad 1 having electrical conductivity variable partially depending on the irregular shape of an object 31 to be polished formed on the semiconductor substrate 3, polishing liquid 41 containing electrolyte, abrasive grains and a chemical component is supplied between the semiconductor substrate 3 and the polishing pad 1 and chemical mechanical polishing of the object 31 is carried out. At the same time, electrolytic polishing of the object 31 is carried out by applying a voltage from a voltage applying section 6 between the semiconductor substrate 3 and an electrode 5 provided on the rear surface 1b of the polishing pad 1. |
