| 发明名称 |
HEAT TREATMENT APPARATUS FOR SEMICONDUCTOR WAFER |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus of a semiconductor wafer, which can prevent air for cooling introduced into a space between a heater and a liner tube from leaking into load chamber. SOLUTION: A clearance between a tube support 5 and a flange 2c of a process tube 2 is sealed by an annular seal packing 16.
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| 申请公布号 |
JP2002093733(A) |
申请公布日期 |
2002.03.29 |
| 申请号 |
JP20000283633 |
申请日期 |
2000.09.19 |
| 申请人 |
KOYO THERMO SYSTEM KK |
发明人 |
ITO MAKOTO;FUKUYAMA YOSHIHARU |
| 分类号 |
F27B5/06;F27D7/06;H01L21/22;H01L21/31;(IPC1-7):H01L21/22 |
主分类号 |
F27B5/06 |
| 代理机构 |
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代理人 |
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| 地址 |
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