| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for wiring and packaging a multi-layer printed wiring board suitable for a multi-layer printed wiring board used for a device using a large current. SOLUTION: In the multi-layer printed wiring board 20 having a circuit pattern and plural kinds of power sources, part of components mounted thereon being provided with a heat sink, a power circuit patterns 18, 19 having large current capacity are arranged on the outer periphery and are opposed to each other between the layers of the multi-layer printed wiring board 20. |
