| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor that can efficiently package the chip of the semiconductor in a module, and to provide a manufacturing method of the semiconductor. SOLUTION: This manufacturing apparatus of the semiconductor for collectively packaging a plurality of chips in a single module has a rotary-type index table, that can load a plurality of wafers containing the chips. In this case, the plurality of chips, selected from among the index tales, can be transferred to the module for collectively joining to the module.
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