发明名称 DIE BONDER
摘要 PROBLEM TO BE SOLVED: To provide a die bonder that can speedily operate a bonding arm, when picking up a die, will not give shock loads to the die at that time, for preventing the die from being damaged. SOLUTION: When the die 6 is to be picked up, a head section 16b at the tip of the bonding arm is descended speedily, while a collet 18b is been pulled upward by a plunger shaft 31b. Then, the collet 18b stops before coming into contact with the die 6. After that, a solenoid 32b is energized by a prescribed, current in the opposite direction, the plunger shaft 31b is allowed to project so that shock is not given to the die 6, and the collet 18b is allowed to project downward. Then, a current value is increased, and a prescribed pickup load is given to the die 6, thus speedily lowering the head section 16b, without giving shocks to the die 6.
申请公布号 JP2002093827(A) 申请公布日期 2002.03.29
申请号 JP20000283422 申请日期 2000.09.19
申请人 NEC MACHINERY CORP 发明人 TONOMURA YUKIHIRO
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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