发明名称 LAMINATED INDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a laminated-layer inductor of chip-size 1005 type for realizing a high Q-value. SOLUTION: An electric insulating layer and a conductive pattern are mutually laminated, and an edge part of each conductive pattern is sequentially connected, to form a coil 5 superimposed in a laminated direction in the electric insulating layer body 2. At the same time, the edge part of the coil 5 is connected to outer electrodes 3 and 4 through drawing conductors 6 and 7 to fabricate a laminated inductor 1 with a size of 1 mm×0.5 mm×0.5 mm. In a laminated chip of 4 nH or smaller, the coil 5 has a conductor width of 60μm or larger, a conductor thickness of 20μm or larger, and a conductor interval of 20μm or larger. In a laminated chip of 4 nH or larger, the coil 5 has a conductor width of 30 to 60μm, a conductor thickness of 20μm or larger, and a conductor interval of 20μm or larger.
申请公布号 JP2002093623(A) 申请公布日期 2002.03.29
申请号 JP20000284881 申请日期 2000.09.20
申请人 FDK CORP 发明人 MASUNO HIROSHI;OBA YOSHINARI;NAWA TATSUHIKO;SUZUKI YASUO;KITAOKA MIKIO
分类号 H01F17/00;(IPC1-7):H01F17/00 主分类号 H01F17/00
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