| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that by the positional variation of the vertex portion of a protruding electrode formed on the electrode of a semiconductor element, the vertex portion of the protruding electrode is bonded pressingly due to the positional discrepancy to the wiring formed on a board, thus make hard the securing of their stable electric connection with each other. SOLUTION: By setting the diameter of a hole 9 of a capillary 8 to a value which is not larger than the width of a wiring 7, the positional variation of a vertex portion 15 of a protruding electrode 6 caused by the capillary 8 is limited within the range of the width of the wiring 7 formed on a board 3, when mounting a semiconductor element 1 on the board 3. Thereby, the vertex portion 15 of the protruding electrode 6 will not extrude from the wiring 7, and stable electrical connections with each other can be made.
|
