| 摘要 |
PROBLEM TO BE SOLVED: To efficiently remove a resin mask from a dielectric base body. SOLUTION: A dielectric base body 1 is formed of synthetic resin material (A), a resin mask 2 is formed of film material selected out of a polyamide high molecule group so as to cover the dielectric base body 1 except its part where a conductive layer 4 is formed (B), the exposed surface of the base body 1 covered with no resin mask is roughened (C), a catalyst for electroless plating is applied on the roughened surface of the base body 1 (D), the resin mask 2 is efficiently removed with a formic acid from the dielectric base body 1 (E), and lastly, the conductive layer 4 is formed on the surface where the catalyst is applied through electroless plating (E).
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