SOLDER JETTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a solder jetting apparatus which can reduce thermal radiation of melted solder and realize a highly reliable soldering. SOLUTION: A heat insulating material 30 is provided between a solder wave and a conveyance route 10 of a printed board P, on the downstream side in the conveyance direction (indicated by arrow mark A) of the printed board P than a contact part Q between the solder wave and printed board P.