MOUNTING STRUCTURE BODY, ELECTRONIC COMPONENT, AND THEIR MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure body, an electronic component, and their manufacturing method by which moisture resistance reliability and heat cycle reliability can be improved by providing a uniform conductive metal oxide layer on the surface of an electrode. SOLUTION: The mounting structure body is formed by electrically connecting an electronic component 1 and a circuit board 5 by using a conductive adhesive agent 10. Metal oxide layers 4 and 8 containing at least one kind of metal comprising a terminal electrode are formed on the adhesion boundary between the electronic component 1 or the terminal electrodes 3 and 7 of the circuit board 5 and the conductive adhesive agent 10. The metal oxide is preferably a passive state of SnO2.