发明名称 |
PRINTED WIRING BOARD OF ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To enable a printed wiring board to be efficiently manufactured by providing the printed wiring boards with mounting holes which are never filled up with solder even when board bodies are subjected to a flow soldering process. SOLUTION: After electronic parts are mounted on a board body 1, the electronic parts are soldered to the circuit pattern of the board body 1 through a flow soldering process for the formation of a printed wiring board for an electronic apparatus. A frame ground 5 which electrically connects the board body 1 to the case of the electronic apparatus is formed by removing a resist 4 from the board body 1 in the radial direction of a mounting hole 1a bored in the board body 1. When the board main body 1 is subjected to a flow soldering process, solder attached to the frame ground 5 is divided into parts in the radial direction, so that the mounting hole 1a is hardly filled up with solder. A soldering correction operation for removing solder filled in the mounting hole 1a can be dispensed with after a flow soldering process is carried out, so that a printed wiring board can be markedly improved in manufacturing efficiency.
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申请公布号 |
JP2002094194(A) |
申请公布日期 |
2002.03.29 |
申请号 |
JP20000280342 |
申请日期 |
2000.09.14 |
申请人 |
HITACHI TELECOM TECHNOL LTD |
发明人 |
TAKITA MASAKICHI;TAKADA SHOSAKU;EBISAWA HIROSHI |
分类号 |
H05K1/02;(IPC1-7):H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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