| 摘要 |
PURPOSE: Provided is an epoxy resin composition for coating the electronic parts, which consists of thinner being added to the main component. The composition material has improved storage stability, processability, mixing uniformity and workability as well as bench time. The composition has thinner mixed in the interior of the main component, so that no separate thinner is needed when the main component and a hardening agent are mixed. There is no need of de-foaming process, thereby making the preparation of composition easy. The above mixed epoxy resin has more than 50% of bench time, thereby making longer time of working period and saving more than 15% of epoxy resin compared with conventional composition. CONSTITUTION: The composition comprises the liquid main component(10) with low viscosity and a polyamide-based hardening agent. The above main component is prepared by: a melting step (S1) of 49-59wt.% of bisphenol A (BPA)-based solid epoxy resin(11) having 170-190 equivalent; the first mixing step (S2) of 14-17wt.% of filler(12), 4-8wt.% of pigment(13), and 1-2wt.% of deformer and additive(14); the second mixing step (S3) of 2-3wt.% of viscosity controller(15); and the third mixing step (S4) of 20-25wt.% of low viscosity reactive thinner(16) to make the liquid main component. |
