| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting that has a number of external terminals formed on the entire surface of the substrate, is set to a size being equal to electronic components to be mounted, can increase mounting density, can efficiently manufacture a film carrier, can efficiently assemble an IC chip, and can reliably and electrically connect the electronic components onto the substrate. SOLUTION: This substrate for mounting has an insulating base 11, a thermosetting adhesive layer 53, and a slit 80. In the thermosetting adhesive layer 53, a surface other than electrodes 34 and 35 of a wiring pattern 24 on one surface of the insulation base is covered with a solder resist layer 36, the wiring pattern that is not covered with the solder resist layer 36 forms a number of electrodes, and the electronic components are temporality fixed onto a surface where the wiring pattern of the insulating base 11 is not formed. In the slit 80, an A1 electrode 83 of the electronic component for allowing junction with a device-side connection terminal 34 of the insulating base 11 is exposed when the electronic component is temporality fixed by the thermosetting adhesive 53. |
