发明名称 JIG DATA FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of forming jig data by selecting a technique corresponding to a production line actually used for a laser via contained in specification data and by modifying the specification data. SOLUTION: Laser vias contained specification data on a wiring board are extracted, and the surrounding conditions are checked. When the outer diameter B of an upper land is larger than the diameter A of a laser via by a prescribed value and the outer diameter C of a bottom laid is larger than the diameter A of the laser via by a prescribed value, the laser via technique is carried out through a large window method.
申请公布号 JP2002094213(A) 申请公布日期 2002.03.29
申请号 JP20000277759 申请日期 2000.09.13
申请人 IBIDEN CO LTD 发明人 KOMORI OSAMU;TAKENAKA TOSHIAKI
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
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