HIGH DIELECTRIC CONSTANT COMPOSITE MATERIAL AND HIGH DIELECTRIC LAYER USING THE SAME AND WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a high dielectric constant composite material which contains at least a resin, a dielectric filler and a conductor filler and laminated by hot press to be capable of revealing a dielectric constant higher than 100, a high dielectric layer using the same composite material and a wiring board having this dielectric layer. SOLUTION: The high dielectric constant composite material contains at least at least a resin, a dielectric filler and a conductor filler containing a soft metal having a Brinell hardness of 50HB or less. The total volume % of the dielectric filler and the conductor filler contained in the high dielectric constant composite material of 100 volume % is preferably 65-90 and the conductor filler is contained preferably 10-30 volume %.