| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable mounting structure, where two boards are connected with each other by soldering them to each other, in a state of their being superimposed on each other. SOLUTION: In the mounting structure of boards for superimposing first and second boards 90, 3 on each other to connect them with each other, there are formed on the first board 90 a land 94 for connecting therewith the second board 3 and on the side surface of the second board 3, a conductive layer 324a connected with conductive patterns 322, 323 formed on the surface of the second board 3, to connect with each other the land 94 of the first board 90 and the conductive layer 324a of the second board 3 by soldering them to each other.
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