| 摘要 |
PROBLEM TO BE SOLVED: To improve the workability required when tabs having mounted ICs for driving a display panel are subjected to thermocompression bondings, and to cut down the production cost of the display panel. SOLUTION: The transparent electrode of a display panel 2 and tabs 3, 4, 5, 6, having mounted ICs for driving the display panel are subjected to thermocompression bondings simultaneously in the plural sides of the display panel. Also, among the partial shapes of a thermocompression bonding head 1 positioned opposite to the display panel 2, the opposite portions to the corner portions of the display panel 2 are chamfered, to thereby absorb the distortions caused by the thermal expansions generated during the thermocompression bondings.
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