| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board with a buildup structure and a method for manufacturing it by which connection between the first layer and the third layer and between the nth layer and the (n-1)th layer can be performed in high density and with a small number of steps and a structure of the multilayer wiring board which causes no blowing up of solder can be obtained. SOLUTION: With respect to the multilayer wiring board which has n layers more than two and in which connection is made between layers 1 and 2, 1 and 3, 2 and 3, n and (n-1), n and (n-2) and (n-1) and (n-2), holes 8 of a diameter of 40μm or less are formed in the insulating layers between the layers 2 and 3, and (n-1) and (n-2) and are filled with copper plating 9 and the layers are connected between 1 and 2, 2 and 3, n and (n-1) and (n-1) and (n-2) respectively. |
