METHOD FOR MANUFACTURING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board by laminating insulating layers on both sides of a core substrate in sequence and connecting the layers by a conductive paste and by which the conductive paste applied on the upper plane is prevented from leaking from a hole and particles are prevented from adhering, when the conductive paste is applied on the lower plane after its application on the upper plane. SOLUTION: Prepreg 5 containing at least organic resin is placed in its semi-cured state on one side of a core substrate 1 on both sides of which circuits are formed by metal foil 2, holes are made in specified parts of the prepreg 5, the holes are filled with conductive paste 3 and metal foil 8 is placed in its semi-cured state on the prepreg. Then the same operations are performed for the other side of the core substrate 1. After that, the resin contained in the insulating layer or adhesive is cured by application of specified temperature and pressure by pressing.